The First International Workshop on Blockchain and Mobile Applications (BlockApp 2019)
10 June 2019 – Hong Kong, China

In Conjunction with The 20th IEEE International Conference on Mobile Data Management, Hong Kong SAR, China


Blockchain has already shown its great success in serving as the fundamental technique behind many cryptocurrencies. Its promising capability of decentralized consensus also attracts a wide realm of real-world applications such as international banking, electronic voting, supply-chain management, media communications, and food safety traceability. Meanwhile, with the advancement of 4G/5G mobile communication techniques, more and more data are being generated by mobile phones, wireless sensors, and IoT devices. Mobile decentralized applications (DApps) usually involve many untrusted parties. How to use blockchain to build trust, reduce the operational cost, and accelerate mobile transactions brings many new open issues and challenges for both research communities and industry.

The International Workshop on Blockchain and Mobile Applications is an international forum that aims to bring together researchers and industry practitioners to foster the advancement of blockchain technique and its applications in mobile environments. The workshop solicits original research contributions or novel blockchain applications and experiments. Topics of interest include but not limited to:

  • Blockchain protocol design
  • Blockchain and 5G mobile networks
  • Blockchain and artificial intelligence
  • Blockchain and big data
  • Blockchain and distributed storage
  • Blockchain and edge computing
  • Blockchain for FinTech applications
  • Blockchain for IoT applications
  • Cryptocurrencies for mobile applications
  • Decentralized App development
  • Decentralized consensus protocols
  • Distributed ledger
  • Efficiency and scalability of Blockchain
  • Hyperledger and its applications
  • Security and threat modelling
  • Smart contracts
  • Token Economy

Supported by

Hong Kong Baptist University (HKBU)

Blockchain and FinTech Lab, Department of Computer Science, HKBU

Paper Format and Submission Instructions

All papers need to be submitted electronically in PDF format through EasyChair ( Papers must be formatted for 8.5x11-inch paper. The length of the paper must be no more than 6 pages in the IEEE double-column format (10-pt font), including references and everything. Papers should neither have been published elsewhere nor being currently under review by another conference or journal. The reviews will be single blind. At least one of the authors of every accepted paper must register and present the paper at the workshop. Accepted papers will be published in the combined IEEE MDM 2019 proceedings and will be submitted to IEEE Xplore.


  • Extended versions of selected papers related to Big Data will be considered for publication in IEEE Transactions on Big Data.
  • Briefs of selected papers will be invited and considered for publication in IEEE Blockchain Technical Briefs.
  • Important Dates

    Paper Submission:
    Extended to March 11, 2019 (anywhere on the earth)
    Result Notification:
    Extended to April 11, 2019
    Camera-Ready Due:
    Extended to May 3, 2019
    Workshop Date:June 10, 2019


    General Chairs:

    James LEI, ASTRI, HKSAR, China

    Chonggang WANG, InterDigital, USA

    Program Co-Chairs:

    Xiaowen CHU, Hong Kong Baptist University, HKSAR, China

    Bin XIAO, The Hong Kong Polytechnic University, HKSAR, China

    Jiang XIAO, Huazhong University of Science and Technology, China

    Technical Program Committee:

    Bin CAO, Chongqing University of Posts and Telecommunications, China

    Hanhua CHEN, Huazhong University of Science and Technology, China

    Shaojing FU, National University of Defense Technology, China

    Bingsheng HE, National University of Singapore, Singapore

    He LI, Muroran Institute of Technology, Japan

    Wei LI, The University of Sydney, Australia

    Hao LIU, Business Intelligence Lab, Baidu Research, China

    Chengnian LONG, Shanghai Jiaotong University, China

    Xiapu LUO, The Hong Kong Polytechnic University, HKSAR, China

    Khaled SALAH, Khalifa University, United Arab Emirates

    Wenhai SUN, Purdue University, USA

    Hong WAN, Purdue University, USA

    Cong WANG, City University of Hong Kong, HKSAR, China

    Honggang WANG, University of Massachusetts, USA

    Yi WANG, Southern University of Science and Technology, China

    Kaishun WU, Shenzhen University, China

    Qingjun XIAO, Southeast University, China

    Jianliang XU, Hong Kong Baptist University, HKSAR, China

    Yuedong XU, Fudan University, China

    Shucheng YU, Fudan University, China

    Lan ZHANG, University of Science and Technology of China, China

    Yiming ZHANG, National University of Defense Technology, China

    Jiaqi ZHENG, Nanjing University, China